Our expertise, access to the state-of-the-art equipment and partnership with laboratories across Europe enable us to provide wide range of electrical characterization services for substrate producers, fabless and foundries. From material to device, including active and passive, Si and III-V, on-wafer and packaged, from DC to mm-wave frequencies, our characterization services are application specific and are tailored to customer’s request.

Radio frequency

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Large signal

  • Harmonics (single tone), intermodulation (dual tone) and power handling
  • Input power up to 49 dBm
  • Noise floor -170 dBm

Small signal

  • S-parameters up to 170 GHz
  • Low frequency from 5 Hz
  • RF figures of merit

5G mm-wave

  • Small- and large-signal
  • Adapted calibration techniques
  • Application specific

Temperature

  • Cryogenic from -270°C (4 K)
  • Hot chuck up to 225°C

Substrate characterization

Harmonics

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Substrate FoM

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Intermodulation

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Crosstalk

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Noise

RF thermal noise

  • 1 – 110 GHz
  • Down to 0.2 dB of NFmin
  • Programmable microwave tuners
  • Measurement of NFmin, Rn, Yopt and NF50
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1/f flicker noise

  • Frequency range from of 0.03 Hz to 40 MHz
  • Noise measurement down to 0.67 nV/sqr(Hz) @ 10 kHz
  • 25 impedance values ranging from 0 ohms to 100 MΩ
  • Current/voltage/power range of up to 0.1 A/200 V/10 W, respectively
  • Supported devices include BJTs, FETs, diodes, resistors and circuits (op-amps, comparators, etc.)

Random telegraph signal noise (RTS, RTN)

  • Time domain representation of noise
  • Current and voltage histograms
  • Supported devices include BJTs, FETs, diodes, resistors and circuits (op-amps, comparators, etc.)
  • 2.5 ns minimum time step
  • Sampling size up to 16 million

Material characterization

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Oxide-substrate charges

  • Flatband capacitance and voltage
  • Oxide thickness
  • Effective & total bulk oxide charge
  • Substrate doping concentration

Dielectric

  • Permittivity
  • Loss tangent

Four point probe

  • Sheet resistance
  • Bulk resistivity

Self-heating

Thermal resistance extraction for SOI MOSFETs and GaN HEMTs

  • Pulsed measurements
  • RF measurements
  • Modelling
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Materials and samples

Silicon Wafers in white plastic holder box on table ,background is white color- A wafer is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits.Wafers with microchips.Rainbow on silicon wafers.Color silicon wafers with glare.

Materials

Silicon: Bulk, SOI, Trap-Rich, Porous, SiC, SiGe ...
III-V: GaN, GaAs ...
Dielectric: Quartz, Fused Silica ...
Piezo: LiTaO3, LiNbO3, ZnO ...
2D: Graphene, hBN ...
Phase-changing: VO2, GeTe ...

Samples

Size: from a single die to 300 mm wafer
Shape: Piece of wafer or whole wafer